Fellow technetters, I taught of using Technet's pool of knowledge to get some recommendations on LCC type devices. We have a customer asking questions on this package, and all I know is that there are concerns of solder joint cracking due to board/ceramic CTE mismatch. What are the pros and cons of LCC devices? Process and manufacturing recommendations? Solder joint reliability? Reliability under extreme environment conditions? Any comment would be greatly appreciated. Thanks! Jorge A Rodriguez Sr. Process Engineer Varian, Inc 480-968-6790 X 4258 [log in to unmask] --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------