Dear Group, I'm asking the group again to impart your communal wisdom in interpreting IPC-A-610. We are seeing solder balls on our SMT assemblies after they have gone thru board wash (dishwasher). Would these be classified as entrapped/encapsulated and therefore process indicators and not subject to "rework" (as long as they don't violate minimum electrical clearance)? Thanks. Tom Moore --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------