For the wave soldering question, via thermal transfer can be minimized by a solder pallet or kapton tape over the vias on the solder side. >>> [log in to unmask] 09/22/04 11:05AM >>> First: Thanks to everyone who gave feedback on my oven question......very helpful!! More BGA questions: Do BGAs require any special treatment when designing PCBs? Can there be top layer traces, vias, and components near the BGA? Is there a good general spacing around them to allow for inspection / repair? Can BGAs be mixed with through-hole and sustain the Wave Solder process (top-side of course) without the use of solder pallets? Thanks again in advance, Peter Crain, C.E.T Manufacturing Engineering > Network Reliability Services > General Electric Canada Inc. > 2728 Hopewell Place N.E., Calgary, Alberta T1Y 7J7 CANADA > Tel: 403.214.4560, Dialcomm: 8.498.4560 Fax: 403.214.4776 > Email: [log in to unmask] > Website: www.gepower.com/substationautomation > > NOTICE: The information contained in this e-mail is privileged, > confidential and intended solely for the use of the addressee named above. > If the reader of this e-mail is not the intended recipient, you are hereby > notified that any dissemination, distribution or copying of this e-mail is > strictly prohibited. If you have received this e-mail in error, please > notify me immediately by telephone (collect) at (1) 403.214.4400 and > destroy this e-mail as well as any copy. Thank you. > > > > --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------