In theory, no, provided
a) that the flux residues are 100% soluble in IPA (not proven: check
with your paste manufacturer)
b) the mechanical force is sufficient to dislodge the solder particles.

However, do remember that if you pump IPA onto a board (or stencil) with
sufficient force for b) above, you have a very effective carburettor
from the spray rebounding off the parts. I wouldn't like to work within
a goodly distance of such a machine, not just from the explosion hazard
but also because it is probably difficult to respect the OEL/PEL when
the machine is opened.

Brian

Black, Paul wrote:

> Hi Everyone,
>
> I currently clean SMT stencils in a sink with hot deionized water. I would like to automate this process (and eliminate the DI water) and have been looking at cleaners that can do the job. One of them uses Isopropyl Alcohol with no rinsing. This should work fine for the stencils but occasionally I also have to clean misprinted boards that may already be populated on one side, using no-clean solder paste. If I were to use this Isopropyl process on the misprints, would I be risking reliability of the board?
>
> Any help would be appreciated.
>
> Thank you,
> Paul Black
> Manufacturing Engineer
> Kronos
> E-mail: [log in to unmask]
> Voice: (978) 947-1520
>
>
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