All, Some questions about multi layer ceramics capacitor (MLCC): 1. Any specification for temperature ramp rate, that is the rate of temp raise or reduce, of MLCC? 2. When mechanical stress is applied to the MLCC, fine crack may induce. However, this may not be checked thru visual inspection or capacitance change. So, is it a good idea to use thermal shock to enlarge this kind of fine crack so that the failure is detectable? Thanks for any suggestion. Rgds, Ernie --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------