Ginny, you may find your answer in IPC-A-600, Bare board acceptability requirements. Barry. -----Original Message----- From: Jeffrey Bush [mailto:[log in to unmask]] Sent: Wednesday, September 22, 2004 11:58 AM To: [log in to unmask] Subject: Re: [TN] Soldermask repair Basic rework procedures exist in IPC-7721 - the requirements for acceptability are outlined in IPC-6012 3.8. Voids in the solder resist are acceptable as long as the site does not grow when subjected to cure and adhesion testing. When mask is designed to the PCB edge, adhesion failures cannot exceed 50% of the spacing to the conductor or .050" maximum. The rule of thumb is any mask defects that affect the assembly or field use are not acceptable and reworks to these conditions shall meet the soldermask performance requirements for dimensional, mechanical, chemical and dielectric. Jeffrey Bush Director, Quality Assurance and Technical Support 76 Technology Drive - POB 1890 Brattleboro, Vermont 05302-1890 Tel. 802.257.4571.21 Fax. 802.257.0011 [log in to unmask] http://www.vtcircuits.com -----Original Message----- From: Genny Gibbard [mailto:[log in to unmask]] Sent: Wednesday, September 22, 2004 1:08 PM To: [log in to unmask] Subject: [TN] Soldermask repair All right, here's my first question for you gurus... Is there an IPC guideline regarding repairing soldermask that may have been removed from a PCB in an area that has only laminate being exposed? I guess we are currently repairing soldermask even when no copper has been exposed. Would there be any reason to consider continuing to do this? Thanks. Genny --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------