Dave Soft gold does have organics, but they are usually muted. If they are present to an extent to prevent bonding I am surprised, but it could happen. If you have a sample from a known good board you might compare its spectrum to the "bad" surface and see if there is a significant difference. Best regards Lee -----Original Message----- From: [log in to unmask] [mailto:[log in to unmask]] Sent: Wednesday, August 11, 2004 4:32 PM To: [log in to unmask]; [log in to unmask] Subject: RE: [TN] Hard Gold Plating/Contaminate Question Hi Lee! Yep, I was typing too fast - I should have said soft gold and not hard gold (I better go get another Diet Coke!). Will soft gold baths have organic codeposition issues? Or is the level of organic control better? Dave "Lee Parker" <lee.parker@theec To: <[log in to unmask]> mg.com> cc: Subject: RE: [TN] Hard Gold Plating/Contaminate Question 08/11/2004 03:16 PM Dave I am surprised it is hard gold; normally you use pure gold for wire bonding. If you really have hard gold then I am not surprised you have organics mixed in the gold as there are organics in hard gold paths to control the plating rate. Lee -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman Sent: Wednesday, August 11, 2004 4:01 PM To: [log in to unmask] Subject: [TN] Hard Gold Plating/Contaminate Question Hi TechNet! Hey, looking for some help (Rudy, Frank, Gerard, plating folks). Background: I have a test board which with approximately 80 uinches of wirebondable hard gold plating that is having gold wirebond process problems. An XPS (xray photoelectron spectroscopy) analysis of a "good" versus "bad" test board revealed that the "bad" has significant organic surface contamination for carbon and oxygen in the form of a hydrocarbon (lots of C-C and C-H bonds). Now the question: can/will a hydrocarbon species be codeposited into the gold plating thickness? I understand the surface process/issues but the codeposit question came up. Dave Hillman Rockwell Collins [log in to unmask] --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------