We are experiencing resist adhesion failures in a random spotty nature, after develop traces and or pads will just not be adhered. We run a cert. piece everyday that never has these problems. The cert piece is ED/double treat right out of the box. The copper that has the adhesion problems has been processed in our shop, we run electrochem's shadow system. I know its not much to go on more details available to anyone interested. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------