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Subject: [TN] Laminate for Lead-free assembly
Date: Fri, 6 Aug 2004 12:11:08 -0500
Message-ID: A<[log in to unmask]>
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Thread-Topic: [TN] Laminate for Lead-free assembly
Thread-Index: AcR72HZVHXwkV4uSQjmi0aBOB8vTRA==
From: "Eddie Rocha" <[log in to unmask]>
Sender: "TechNet" <[log in to unmask]>
To: <[log in to unmask]>
Reply-To: "TechNet E-Mail Forum" <[log in to unmask]>,
"Eddie Rocha" <[log in to unmask]>
Can somebody help me with this question? Will PCB fabricators need to =
use a
different type of laminate for the lead free assembly process? I =
understand
the temperatures will be higher for lead-free solders so will the =
typical
high temperature FR4's (170-180 Tg) be acceptable?
I ask this because I see a new high temperature FR4 with the same =
170-180 Tg
offered by the laminate suppliers. Is there another requirement for the
laminate that is needed for lead-free assembly?
thanks,
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