Can somebody help me with this question? Will PCB fabricators need to use a different type of laminate for the lead free assembly process? I understand the temperatures will be higher for lead-free solders so will the typical high temperature FR4's (170-180 Tg) be acceptable? I ask this because I see a new high temperature FR4 with the same 170-180 Tg offered by the laminate suppliers. Is there another requirement for the laminate that is needed for lead-free assembly? thanks, --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------