Hi TechNet! Hey, looking for some help (Rudy, Frank, Gerard, plating folks). Background: I have a test board which with approximately 80 uinches of wirebondable hard gold plating that is having gold wirebond process problems. An XPS (xray photoelectron spectroscopy) analysis of a "good" versus "bad" test board revealed that the "bad" has significant organic surface contamination for carbon and oxygen in the form of a hydrocarbon (lots of C-C and C-H bonds). Now the question: can/will a hydrocarbon species be codeposited into the gold plating thickness? I understand the surface process/issues but the codeposit question came up. Dave Hillman Rockwell Collins [log in to unmask] --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------