I have a question for all of you out there that source parts. My question specifically relates to connectors - and the evolution of said connectors. If, say, a connector had a thin layer of gold plating on the contact area - roughly 1 microinch of gold (minimum) - how many insertions would that connector be capable of before degradation of the gold surface area? Also - is it common practice these days, in light of the changing economic conditions and in the pursuit for ever cheaper options - to have a connector pin (the internal portion - where a board's gold fingers would be inserted into - I am not referring to the portion of the connector that is inserted through the board and soldered) that has been gold plated, but the utmost top portion of the connector is regular tin/HASL? And what type of contact retention force would be necessary to secure a module into a connector - through system build, shipment and long-term storage before sale of said system? Additional questions - will a gold finger surface (immersion gold) that has 6 - 20 micro inches of gold ever burnish, discolor for any reason? Or should it always be shiny and bright? Will hard gold have the same cosmetic appearance as soft gold? If anyone has technical resources they could send my way related to this topic, I would greatly appreciate the assistance. I have combed the Tech Net archives (found a lot of great info - but not an answer to this specific question) and I have also acquired the discontinued MIL spec MIL-G-45024. Unfortunately, these areas didn't really help me. So, I figured that I would ask the experts the directly!!! Thanks. -D --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------