To all: Reminder- Abstracts for DesignCon 2005 are due today. Sessions #5 and #11 have Embedded Passives as topics. See www.designcon.com for more info and to submit your abstracts on-line. Your participation will be greatly appreciated. Best Regards, John -----Original Message----- From: Andresakis, John [mailto:[log in to unmask]] Sent: Tuesday, July 06, 2004 12:30 PM To: [log in to unmask] Subject: [EM] FW: DesignCon 2005 Call for Papers To all: This is a follow-up to the email sent by Dennis Fritz last week. I am on the technical committee and will be part of the team reviewing papers related to PCBs. I want to encourage everyone to consider presenting papers on Embedded Passives. DesignCon is a show put on by designers for designers and these are the very people we need to get the message too on embedded passives. Use the on-line form to submit an abstract. Thanks Best Regards, John -----Original Message----- From: Barry Sullivan [mailto:[log in to unmask]] Sent: Wednesday, June 30, 2004 1:00 PM To: [log in to unmask] Subject: DesignCon 2005 Call for Papers Abstract submission deadline: August 13, 2004 The International Engineering Consortium (IEC) is pleased to announce its Call for Papers for DesignCon 2005, the leading educational conference and technology exhibition for semiconductor and electronic design engineers held each year in Santa Clara, California. The IEC is currently accepting abstract submissions in two session categories: * Technical papers (40-minute sessions, February 1-2) addressing design case studies and application overviews * TecForums tutorials (3-hour sessions, January 31 and February 3) covering advanced topics in greater depth and breadth Fifteen suggested <http://www.iec.org/cgi-bin/pr.pl?CID=1008494&EC=1501&LN=http%3A%2F%2Fwww%2E designcon%2Ecom%2Fconference%2Ftopic%5Fcategories%2Ehtml&POS=1> paper topics are available for your perusal. To submit an abstract for consideration, please complete the on-line Author <http://www.iec.org/cgi-bin/pr.pl?CID=1008494&EC=1501&LN=http%3A%2F%2Fwww%2E designcon%2Ecom%2Fconference%2Faif%2Ehtml&POS=2> Information Form (AIF). For up-to-date information on DesignCon 2005, visit www.designcon.com <http://www.iec.org/cgi-bin/pr.pl?CID=1008494&EC=1501&LN=http%3A%2F%2Fwww%2E designcon%2Ecom%2F&POS=3> . Best regards, Barry Sullivan DesignCon 2005 Conference Director [log in to unmask] <mailto:[log in to unmask]> _____ The International Engineering Consortium periodically sends e-mails to constituents and other professionals in the communications industry announcing new research reports, upcoming seminars, and or other IEC initiatives. If you would prefer not to receive further e-mail messages from the IEC, click <http://www.iec.org/cgi-bin/unsubscribe.pl?CID=1008494&EC=1501&EM=john.andre [log in to unmask]> here to unsubscribe. Please email any comments to [log in to unmask] <mailto:[log in to unmask]> IEC | 549 W. Randolph Street, Suite 600 | Chicago, IL 60661-2208 USA