It was recently brought to my attention (rumored) that connector
manufacturers are not able to meet the 0.1% lead content for standard I/O
connectors because they have to use high lead content steel in the forming
of the connector shells in industry standard I/O connectors such as
ubiquitous D-subs, MDR's etc.

Does this ring true?  If so does anyone have knowledge of how the connector
manufacturers are planning on getting around this?

Thanks,

Mike Haff
Enhance, Inc.

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