To All, I just had an assy house recommend a diamond shape or tear drop shape for a BGA land pattern to allow for better optical inspection related to reflow and solder opens detection. Has anyone come across a white paper or reliability study for or against alternative pad shapes for BGAs? dave -- Dave Seymour, CID+ Catapult Communications Inc. 800 Perimeter Park Dr, Suite A Morrisville, NC 27560 Direct: (919)653-4249 Main: (919)653-4180 Fax: (919)653-4297 [log in to unmask] --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------