We want to fill our via's in smd land with conductive material so the land will be flat and no PPT will fall into the hole. I cannot find an IPC specification that calls out a conductive via fill for a drill drawing note. I know not to be too specific on the type of material to be used and that I do want it planerized and followed with subsequent plating finish. Is anybody aware of an IPC drill drawing specification or would like to share how they specify this process on there drill drawing? --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------