We're a CM. One of our customers is asking us to build a board assembly that will be using BGAs with VIAs in pads. They are in the design stages at this point, and we have some concerns with having a Via in the middle of a BGA pad. Anyone have suggestions and/or experience with this?? Thanks Tom Parkinson - Quality System Manager - CIT WinTronics, Inc. Ph: 724-981-5770 Ext. 235 Fax: 724-981-1772 --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------