We have seen over aggressive micro-etch prior to NI undercut the mask and affect the adhesion - a microsection across the interface will show the "step" where the exposed conductors were etched verses the area protected my mask and rate can be determined. Some masks are also less compatible with ENIG than others. Jeffrey Bush Director, Quality Assurance and Technical Support 76 Technology Drive - POB 1890 Brattleboro, Vermont 05302-1890 Tel. 802.257.4571.21 Fax. 802.257.0011 [log in to unmask] http://www.vtcircuits.com -----Original Message----- From: Kathy Bergman [mailto:[log in to unmask]] Sent: Thursday, June 24, 2004 8:14 PM To: [log in to unmask] Subject: [TN] ENIG and flaking mask Hello Tech Netters, Has anyone dealt with the following condition: Bare boards are ENIG, several SMT pads within wide traces. After ENIG, soldermask is peeling from copper on the traces, at the junction of the ENIG and mask. We have eliminated any mask failure possibilities. What, if anything in the ENIG process (or error in the process) would compromise the soldermask adhesion and lift it from the copper? Any help will be appreciated. K Bergman --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------