We did some rework on a board with those components. We found it necessary to maintain a fairly low delta between the component and the bottom side of the board. Even a little crown produces solder bridges in the center balls. The package stayed flat as a stone (unlike that Flex 484 package). It should not be a problem in a reflow oven. > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory > Sent: Thursday, June 03, 2004 2:09 PM > To: [log in to unmask] > Subject: [TN] Xilinx Virtex-II BGA's... > > Afternoon All! > > We've quoted some work here to build some boards with a 3-per > assembly, Xilinx Virtex-II, 1152-ball BGA on them. > > Have any of you ever placed these BGA's before? Is there > anything special about them to look out for when assembling them? > > This will be my first time messing around with a BGA with > that kind of ball count, and at over $6,000 each, I sure > don't want to screw things up... > > TIA!! > > -Steve Gregory- > --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------