Ken, Exposure to 288 degrees C for a period of time (T260 = 260 degrees C exposure). David A. Douthit Manager LoCan LLC Ken Patel wrote: >Gerard, >HASL - I meant eutectic solder (63/37). > >What does it mean T288 performance? > >Re, >Ken Patel > >-----Original Message----- >From: Gerard O'Brien [mailto:[log in to unmask]] >Sent: Wednesday, June 16, 2004 5:05 AM >To: TechNet E-Mail Forum.; Ken Patel >Subject: RE: [TN] Lead-free Assy process and fab surface finish > >Ken - depending on the OSP coating being used and the flux activation levels >- you may be forced into N2 atmosphere. For ENIG we have seen no problems. >For HASL - do you mean a lead free alloy? > > >The Tg of the material is NOT as critical as the T288 performance. A >laminate with a T288 of 15+ minutes will provide you all the necessary >performance needed for Pb free assembly. There are many Tg 170 materials out >there that have excellent T260 results but blow up ever before reaching >288C. > >Regards > > >Gerard O'Brien >Photocircuits Corporation > >-----Original Message----- >From: Ken Patel [mailto:[log in to unmask]] >Sent: Tuesday, June 15, 2004 4:07 PM >To: [log in to unmask] >Subject: [TN] Lead-free Assy process and fab surface finish > >Technetters, > >I do have few questions related to fab surface finish in lead-free assembly >environment. > > > >(1)Do you see any problem with board surface finishes, particularly OSP, >HASL, and Nickel-Gold? > > > >(2) What should be the minimum Tg of Fab material? Is Tg of >170C is good >enough? > > > >Re, > >Ken Patel > > >--------------------------------------------------- >Technet Mail List provided as a service by IPC using LISTSERV 1.8e >To unsubscribe, send a message to [log in to unmask] with following text in >the BODY (NOT the subject field): SIGNOFF Technet >To temporarily halt or (re-start) delivery of Technet send e-mail to >[log in to unmask]: SET Technet NOMAIL or (MAIL) >To receive ONE mailing per day of all the posts: send e-mail to >[log in to unmask]: SET Technet Digest >Search the archives of previous posts at: http://listserv.ipc.org/archives >Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 >for additional information, or contact Keach Sasamori at [log in to unmask] or >847-509-9700 ext.5315 >----------------------------------------------------- > >--------------------------------------------------- >Technet Mail List provided as a service by IPC using LISTSERV 1.8e >To unsubscribe, send a message to [log in to unmask] with following text in >the BODY (NOT the subject field): SIGNOFF Technet >To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) >To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest >Search the archives of previous posts at: http://listserv.ipc.org/archives >Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 >----------------------------------------------------- > > > > --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------