Jeff and Roger - You've both proposed these vias be filled with conductive via fill. But the fill does not need to be conductive. We've used both types of fill materials and found the non-conductive to have superior processing capability. Mike McMaster RF Product Engineer Merix Corporation 503-992-4263 > ---------- > From: Jeffrey Bush[SMTP:[log in to unmask]] > Reply To: TechNet E-Mail Forum.;Jeffrey Bush > Sent: Friday, June 25, 2004 9:20 AM > To: [log in to unmask] > Subject: Re: [TN] VIA in Pad > > I will suggest a conductive via fill in these areas to provide a flat > SMT site, because - solder joint could be starved by flow down into the > via. Also Sm plugged on the opposite side will also cause excessive > voiding as the capped via will provide a good outgassing effect during > relow. Not the cheapest solution but is effective in hiding vias in > pad. > > > > Jeffrey Bush > Director, Quality Assurance and Technical Support > > 76 Technology Drive - POB 1890 > Brattleboro, Vermont 05302-1890 > Tel. 802.257.4571.21 Fax. 802.257.0011 > [log in to unmask] > http://www.vtcircuits.com > > > > -----Original Message----- > From: Tom Parkinson [mailto:[log in to unmask]] > Sent: Friday, June 25, 2004 11:14 AM > To: [log in to unmask] > Subject: [TN] VIA in Pad > > > We're a CM. One of our customers is asking us to build a board assembly > that will be using BGAs with VIAs in pads. They are in the design > stages at this point, and we have some concerns with having a Via in the > middle of a BGA pad. Anyone have suggestions and/or experience with > this?? > > Thanks > > > Tom Parkinson - Quality System Manager - CIT > WinTronics, Inc. > Ph: 724-981-5770 Ext. 235 > Fax: 724-981-1772 > > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 1.8e To > unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or > (re-start) delivery of Technet send e-mail to [log in to unmask]: SET > Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the > posts: send e-mail to [log in to unmask]: SET Technet Digest Search the > archives of previous posts at: http://listserv.ipc.org/archives Please > visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for > additional information, or contact Keach Sasamori at [log in to unmask] or > 847-509-9700 ext.5315 > ----------------------------------------------------- > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 1.8e > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 > for additional information, or contact Keach Sasamori at [log in to unmask] or > 847-509-9700 ext.5315 > ----------------------------------------------------- > --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------