Hi Victor, We have never had a problem finding cracks/fractures in cross-sectioned solder joints as long as the sample prep was good. We use a colloidal silica solution (0.05 micron)on a soft nap cloth for a final polish. This is after a 6 and 1 micron diamond polish on a harder cloth. All the metallographic suppliers, Allied, Buehler, Struers, Leco, etc. stock a colloidal silica solution with a pH of 9 or better for this type of polishing. I would be glad to go into more detail or even cross-section a couple of samples for you if you would like. Thanks, Wade McFaddin Nextek Inc. Analytical Laboratory (256)772-1995 ext.1064 -----Original Message----- From: Victor G. Hernandez [mailto:[log in to unmask]] Sent: Tuesday, June 01, 2004 9:43 AM To: [log in to unmask] Subject: [TN] SnPb Etchant and LF enchants Fellow TechNetters: Can anyone shares their experience with SnPb solder etchant, I want to decorate the solder fillet to search for potentials fractures after a Post reliability environment. SnPb is soft and I don't want to overlook artifacts due to smearing during the final polishing process. Once upon a time in a previous life a co-peer instructed me to used a Buehler Final Masterpolish with a pH of 9. Victor, --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------