Experts, I searched a couples of documents about BGA leadfree backward/forward compatibility and can not find a clear answer about this issue. 1. Backward compatibility. How about the solder-joint quality after we changed the oven profile above 230C compared with the conventional tin-lead solder-joint? 2. Forward compatibility. A document from NEMI with datum showed the voids increased but no explaination. What's the root cause? BGA looks like a big question when transition to lead-free. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------