Rudy, It's not supposed to be any Au layer left after re-flow. It desolves in solder. Vladimir Sent from my Blackberry Wireless Vladimir Igoshev, 519-888-7465 ext.5283 -----Original Message----- From: Rudy Sedlak <[log in to unmask]> To: [log in to unmask] <[log in to unmask]> Sent: Tue May 04 10:05:27 2004 Subject: Re: [TN] Corrosion resistance of Ni/Au plating Central to this issue is the question of whether the Gold was completely covered by the Tin/Lead solder. I suspect it was not, and if it was not, this would set up a galvanic cell, which would accelerate the attack on the Tin Lead dramatically. Rudy Sedlak RD Chemical Company --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------