Don't miss out on this opportunity to submit an abstract or educational course proposal on the HOTEST topic around. The IPC/JEDEC 6th International Conference on Lead Free Electronic Components and Assemblies in Singapore August 18-20, 2004. Papers are sought in all areas, including: * Policy - European Lead Ban status * EMS Industry - on the front line of the change. * Component issues (Passives and Actives) * Design issues * Environmental health and safety effects (on the alternatives too!) * PCB issues * OEM/Consumer demands/voluntary elimination dates * Recycling options * Substitution - New commercially available alloys/conductive adhesives/ease of replacement * Cost issues * Reliability evaluations, e.g., temperature cycling data, tin whiskers evaluation * Roadblocks to implementation * Finishes issues - Organic solder protectants, immersion tin, silver, electroless nickel, palladium, etc. * Lead-free and other product sectors (automotive, aerospace, etc.) The International Lead Free Conference offers time slots between 30-45 minutes long. Some papers may be grouped together in a forum or panel discussion. To submit an abstract, please include an abstract of 200-300 words along with a brief biography via e-mail to [log in to unmask] --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------