It is an accelerated test for marine environments. > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of David Douthit > Sent: Tuesday, May 04, 2004 12:56 PM > To: [log in to unmask] > Subject: Re: [TN] Corrosion resistance of Ni/Au plating > > Eric, > > Just exactly how does this "salt fog" test correspond to your > possible end use environments? > > David A. Douthit > Manager > LoCan LLC > > Eric CHRISTISON wrote: > > >Ok, thanks for the info. > > > >No clear cut answers but I guess PCB finish doesn't make that much > >difference. > > > >Can anyone tell me if lead free solders perform better in corrosive > >environments? > > > >Thanks, > > > >Eric Christison Msc > >Mechanical Engineer > >Consumer & Micro Group - Imaging Division STMicroelectronics > >33 Pinkhill > >Edinburgh > >EH12 7BF > >UK > > > >Tel: +44 (0) 131 336 6165 > >Fax: +44 (0) 131 336 6001 > > > > > >-----Original Message----- > >From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman > >Sent: Tuesday, May 04, 2004 3:48 PM > >To: [log in to unmask] > >Subject: Re: [TN] Corrosion resistance of Ni/Au plating > > > > > >Hi folks! Some additional data - we (e.g. the industry > technoweinees) > >are much too quick to jump to the conclusion that we have a galvanic > >compatibility problem when using either immersion gold or immersion > >silver pwb finishes. Rockwell Collins published a paper at > the 2003 IPC > >Fall meeting which demonstrated that the galvanic impact was > secondary > >to a standard corrosion reaction in a salt fog test - i.e. > our tin/lead > >test samples which were in a galvanically happy couple situation > >underwent healthy corrosion. The galvanic compatibility > tables are very > >important and should not be ignored but they also can be misleading > >depending on the environment/configuration. Collins has a follow up > >immersion silver, immersion gold, immersion tin, and > tin/lead galvanic > >corrosion study in progress and will report the results > sometime in early 2005. > > > >Dave > > > > > > > > Vladimir Igoshev > > <[log in to unmask] To: > [log in to unmask] > > > cc: > > Sent by: TechNet Subject: Re: > [TN] Corrosion > >resistance of Ni/Au plating > > <[log in to unmask]> > > > > > > 05/04/2004 09:19 > > AM > > Please respond to > > "TechNet E-Mail > > Forum."; Please > > respond to > > Vladimir Igoshev > > > > > > > > > > > > > > > >Rudy, > > > >It's not supposed to be any Au layer left after re-flow. It > desolves in > >solder. > > > >Vladimir > >Sent from my Blackberry Wireless > >Vladimir Igoshev, 519-888-7465 ext.5283 > > > > > >-----Original Message----- > >From: Rudy Sedlak <[log in to unmask]> > >To: [log in to unmask] <[log in to unmask]> > >Sent: Tue May 04 10:05:27 2004 > >Subject: Re: [TN] Corrosion resistance of Ni/Au plating > > > >Central to this issue is the question of whether the Gold was > >completely covered by the Tin/Lead solder. > > > >I suspect it was not, and if it was not, this would set up a > galvanic > >cell, which would accelerate the attack on the Tin Lead dramatically. > > > >Rudy Sedlak > >RD Chemical Company > > --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------