Hello all, After running a single pass of a double sided SMT board, the bottom side solder from HASL is spiking and pooling up in the middle of the pad (from gravity), forcing us to wick and prep the side prior to running the bottom. You can actually see the copper showing lightly around the edges of the pads. We are running vapor phase reflow and the solder paste used is SN96 (high temp soldering). Has anyone seen this? I am leaning towards profile issues. However, I wanted to see if anyone has seen this and if it was fab issues or not. TIA, Jason Gregory Manufacturing Engineer LaBarge Inc. --- Houston (281)207-1464 (281)207-1435 fax (832)724-0076 cell [log in to unmask] http://www.labarge.com --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------