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Message-ID: <011301c4353f$83aef6b0$647c6099@thomidesk>
From: [log in to unmask] (Thomi)
To: "Todd MacFadden" <[log in to unmask]>
References: <[log in to unmask]>
Subject: Re: [LF] reliability study on SAC with various PCB and component         finish combinations
Date: Sat, 8 May 2004 23:00:37 +0200
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Hi Todd,

as we are working on a similar issue, with regard to voiding in lead free
BGA solder balls, may I ask you to send me a copy of your latest paper as
well? Thank you very much!

Regards,

Thomas Ahrens, Boostedt
e-mail [log in to unmask]
----- Original Message -----
From: "Todd MacFadden" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, May 07, 2004 2:57 PM
Subject: Re: [LF] reliability study on SAC with various PCB and component
finish combinations


> Hi Santhakumar,
>
> The Massachusetts Lead Free Consortium has conducted two phases of LF
> reliability testing with some of the parameters you mention. We
> utilized five lead-free board finishes (HASL, matte Sn, OSP, immersion
> Ag, and ENIG), two atmospheres (air and N2), and three flux
> formulations of NEMI SAC solder paste, using component leads finished
> with matte tin, NiPdAu, NiAu and SnAgCu.
>
> I just tried unsuccessfully to attach our most recent paper. (I can
> send it to you directly if wish - respond to me off-line), Meanwhile,
> you can find older papers summarizing our work on our webpage (plus a
> lot of other great LF presentations) at:
>
> http://www.turi.org/messages/lead_free_electronics.htm
>
> The good news that we found is that reliable lead free assembly is
> possible - if you do your homework.
>
> Good luck!!
>
> Todd MacFadden
> Project Manager of Research and Training
> Toxics Use Reduction Institute
> University of Massachusetts Lowell
> 978.934.3391
> [log in to unmask]
> www.turi.org
>
> ----- Original Message -----
> From: santhakumar rajesnayagham <[log in to unmask]>
> Date: Thursday, May 6, 2004 11:48 am
> Subject: [LF] reliability study on SAC with various PCB and component
> finish combinations
>
> > Hi All,
> > Has anybody performed reliability studies on the following
> > combination?Solder paste: SAC (any combination)
> > PCB finish: Immersion Silver or Immersion Tin
> > Component finish: any lead-free finish is ok
> > for a variety of components?
> > Thank you,
> > Sincerely,
> > Santhakumar
> >
> >
> >
> > Fern Abrams <[log in to unmask]> wrote:Just to clarify, IPC filed
> > comments with the EU Technical Adaption
> > Committee regarding the need for clarification proposed definition of
> > LF:
> >
> > "A maximum concentration value of 0.1% by weight in homogeneous
> > materials
> > for lead, mercury, hexavalent chromium, polybrominated biphenyls (PBB)
> > and
> > polybrominated diphenyl ethers (PBDE) and of 0.01% weight in
> > homogeneousmaterials for cadmium shall be tolerated. Homogeneous
> > material means a
> > unit
> > that can not be mechanically disjointed in single materials".
> >
> > While I have had no formal response, we have heard informally that
> > thisis unlikely to be further clarified and may end up being
> > settled in
> > court.
> >
> > Fern Abrams
> > Director of Environmental Policy
> > IPC - The Association Connecting Electronics Industries
> > 1333 H Street, NW, 11th Floor West
> > Washington, DC 20005
> > (202) 962-0460
> > fax (202) 962-0464
> > www.ipc.org
> >
> >
> >
> >
> > -----Original Message-----
> > From: Bev Christian [mailto:[log in to unmask]]
> > Sent: Wednesday, May 05, 2004 4:49 PM
> > To: [log in to unmask]
> > Subject: Re: [LF] Lead in resistors
> >
> > Gordon,
> > No, not very comforting.
> >
> > The IPC Materials Declaration Team has sent a letter to the
> > appropriateEU personnel asking for clarification of some of these
> > issues, but to
> > the best of my knowledge Fern has still not received an answer.
> > This is
> > probably because they (EU) had not thought that far ahead when they
> > drafted the dreadful thing in the first place. As more than one
> > wag has
> > stated, we will probably have to wait for clarification when that
> > firstunfortunate company is dragged into court. Then we MIGHT get
> > definitiveanswers.
> > regards,
> > Bev Christian
> > Research in Motion
> >
> > -----Original Message-----
> > From: Davy, Gordon [mailto:[log in to unmask]]
> > Sent: May 5, 2004 4:26 PM
> > To: [log in to unmask]
> > Subject: Re: [LF] Lead in resistors
> >
> >
> > Bill Haas has noted that 0402 surface-mount "lead-free" resistors were
> > found to contain more than 1000 ppm Pb, and that the suppliers assured
> > him that this is OK per the RoHS legislation. Bill wanted to know
> > whereit says in the directive that what the resistor manufacturers
> > told him
> > is so. Annex item 7 exempts Pb in "electronic ceramic parts (e.g.
> > piezoelectronic devices)", so it looks as if this is what they are
> > referring to.
> >
> > What the Directive doesn't say anywhere, of course, is that for
> > components not exempted by the Annex the maximum allowable level
> > is 1000
> > ppm, or how the limit (whatever it turns out to be) is to be
> > calculated- i.e., what is to be used as the fraction denominator:
> > terminationfinish, component as a whole, assembly as a whole,
> > equipment as a whole.
> > Article 4 paragraphs 1 and 2 say that there can't be any Pb at all
> > except per the Annex, and paragraph 3 puts manufacturers on notice
> > thatthey may have to eliminate other stuff later.
> >
> > Also not spelled out is how users of components - such as Bill - are
> > expected to document that the equipment items that they are
> > selling are
> > Pb-free: will the envirocops be satisfied if the equipment
> > manufacturercan produce upon demand a certificate of compliance
> > from the
> > manufacturers of each component? If not, how diligent does the
> > originalequipment manufacturer have to be to ensure that no Pb
> > above the
> > to-be-determined limit (except as permitted by the Annex) has
> > crept into
> > his product?
> >
> > As an analogy, hardware destined for space has long had a prohibition
> > against pure tin plating. Yet every time a satellite has been audited,
> > cases of pure tin plating have been found, due simply to human error.
> > Can you imagine the jeopardy of the manufacturer of an electronic
> > system, wondering if a particular item will be randomly selected
> > to find
> > out if it contains Pb? (X-ray fluorescence will be useless for
> > levels of
> > 1000 ppm, so if that's the level that is finally chosen, we're talking
> > serious chemical analysis.)
> >
> > Article 8 specifies that the penalties are to be "effective,
> > proportionate, and dissuasive." I don't see any language
> > describing how
> > disagreements are to be resolved, or what happens to the equipment
> > whilethe matter is being settled. Not very comforting.
> >
> > Gordon Davy
> > Baltimore, MD
> > [log in to unmask]
> > 410-993-7399
> >
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> > -------------------------------------------------------------------
> > ------------
> >
> >
> > Santhakumar Rajesnayagham
> > Graduate Student & Research Assistant
> > Center for Electronics Manufacturing and Assembly (CEMA)
> > Rochester Institute of Technology, Rochester, New York
> > Phone : (CEMA Lab) 585-475-7293
> >
> >
> >
> >
> >
> > ---------------------------------
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> >
> >
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> >
> >
> >
>
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