Hi Again Doug, and IPC LF Listservers, I would like KeithS to come out and add just a little on how he does LF on Paper Laminate. If I remember right the Tg of some of the paper phenolics are less than glass and Keith might be able to tell us the Tg of the material he used. It is probably a simple design with simple, and small components. I have also seen reports of LF being done on standard 115-125 Tg FR4/Gll which leads me to say you will need a higher Tg only if your printed circuit board assembly needs it. On the other hand I know some of the KEDS products (ABS Brakes) that Rick produces and he will probably need the higher Tgs for some of their products. I think we all know that the large CEMs or EMS houses are pushing for higher temperatures (260 peak vs 235 in reflow) yet that is because they have PWB, PWA, board, planar, and component complexity. Thanks KEDS-Rick for the lead on the APEX paper. Yours in Engineering, Dave YiEng, MA/NY DDave -------------------------------------------------------------------------------Leadfee Mail List provided as a service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Leadfree To temporarily stop delivery of Leadree for vacation breaks send: SET Leadfree NOMAIL Search previous postings at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -------------------------------------------------------------------------------