Roger, I would like to share what I have just discussed and learned from Robert while reading his book on "High Power Printed Circuit Design Notebook". He replied me on a similar question that I asked of him. He replied as "Typically, start with say 54ox of copper as a base and plate 6 to get 10oz on the surface an d6 in the hole. For some power boards that require more in the via/hole, he would start with 1oz and plate 9oz so the surface has 10 and the hole has 9oz." For you case, I guess it is not possible to have same copper thickness for both surface and thickness. Then, I may be wrong as your vendor should be able to advice. Hope my information can be of some help. Regards, Wee Mei Roger Alexander wrote: >Hello all, > I have a question concerning the stack-up for a 2 layer board in which >I need 3 oz. copper plating in the barrels. What copper foil thickness >should I specify? I want to insure that I get 3 oz. copper for all >lands/traces and in the barrels of all holes. I have never specified 3 >oz. copper and didn't really know what is typically done for 3 oz. copper. > >Thank you, > >Roger > >--------------------------------------------------- >Technet Mail List provided as a service by IPC using LISTSERV 1.8e >To unsubscribe, send a message to [log in to unmask] with following text in >the BODY (NOT the subject field): SIGNOFF Technet >To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) >To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest >Search the archives of previous posts at: http://listserv.ipc.org/archives >Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 >----------------------------------------------------- > > --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------