Rey, There is no "industry standard for moisture content", to my knowledge. There is a test, IPC-TM-650 2.6.2.1, for moisture absorption for rigid laminates. Each "laminate" has a different maximum requirement based on its' resin and reinforcement system (the % uptake by weight is different for polyimide than it is for epoxy); and the test is based on a 2" square of a relatively thick material. Also, there is no requirement for prepreg (although there is a requirement for maximum volatile content). Anyway, what the interested party needs to do is compare numbers from each suppliers specification sheets, which while they cannot predict performance in certain environments, they are relative comparisons of propensity to absorb moisture. Then, if the product in use will be exposed to particularly humid conditions, "bias" the choice of laminates to a low moisture uptake material. (and those numbers can be different from manufacturer to manufacturer for "generic" material families). You need more information on what problem they are trying to solve or trying to avoid (unless they are just sniffing around for specs, which is not usually the case). Valerie "Stolar, Paul W" <[log in to unmask]> Sent by: TechNet <[log in to unmask]> 04/14/2004 09:28 AM Please respond to "TechNet E-Mail Forum."; Please respond to "Stolar, Paul W" To: [log in to unmask] cc: Subject: Re: [TN] PCB moisture content We had a serious problem with moisture in our boards. But we use polyimide with high temp solders. You will have to evaluate for your own application. Paul Stolar Materials/Reliability Engineer Manufacturing Reliability Lead Engineer Baker Atlas 713-625-5376 -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Guy Ramsey Sent: Wednesday, April 14, 2004 6:56 AM To: [log in to unmask] Subject: Re: [TN] PCB moisture content Not to my knowledge. There is J-STD-020 and a brief section in HDBK-001. But neither set a standard for moisture content. > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Rey Degollado > Sent: Wednesday, April 14, 2004 7:25 AM > To: [log in to unmask] > Subject: [TN] PCB moisture content > > Hey Guys, > > One of our customers is asking on what is the industry > standard for pcb moisture content and the method of checking. > Can somebody please help? Should there be standard reference > (book, etc) you can recommend.. Better. > > Thanks. > > Rey Degollado > --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------