There is no requirement either way. While I generally use paste flux only, I believe the general past tech-net consensus is that both methods work well. Adding solderpaste, while more difficult, should result in larger package standoff which will improve reliability. Regards, Bruce Misner -----Original Message----- From: Reuven ROKAH [mailto:[log in to unmask]] Sent: Wednesday, April 07, 2004 3:27 AM To: [log in to unmask] Subject: [TN] BGAs Repair Using solder paste or flux per pitch Hi All , Jack, Pls inform if there is IPC list, recommendation / requirement of using solder paste or flux paste in accordance with the BGAs pitch or technology (ceramic. plastic package) in the rework process. If yes, pls detail. Thanks and happy and peaceful eastern holiday. Best Regards Reuven ROKAH --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------