Thanks. We are thinking about printing paste on the pads. We may have already ordered the stencil. I don't think we will be using the hot bar because of the uneven thermal loading on the pads but it is still possible. We are somewhat limited in options by the configuration of the assy. -----Original Message----- From: Mike Szuch [mailto:[log in to unmask]] Sent: Wednesday, March 03, 2004 3:05 PM To: [log in to unmask] Subject: Re: [TN] hot bar soldering Advantages of hot bar are localized heating, leads held in place and low cost. Ground planes can be an issue since they suck a lot of heat. Look for good ramp control of heat profile. Hot bar works best with solder pre-forms or pre-reflowed solder on pads. Raw paste is difficult to relow consistantly. Hope this helps. I spent 13 years with Hughes/Palomar, contact me if you need more detail. Mike. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------