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Doug,
See below

OK class, time for your next assignment.

Again, the topic is "qualifying" a manufacturing process, either in house
or from a supplier. Steve Gregory has been kind enough to post a picture
for me

http://www.stevezeva.homestead.com and look for "IEC Coupon".

This is a coupon that has been proposed in the IEC specification that
Graham Naisbitt is working on. There is some re-design efforts going on
currently. One such effort is to add through holes for a connector or pin
field. As you can see from the picture, the current board is purely
surface mount.

So, your assigment, in essay form, is to answer the following three
questions:

1. As a process qualification vehicle, should the vehicle be pure
surface mount, or mixed technology (both SMT and PTH), and why?

Multiple coupons would likely allow specific process qualification.
Why qual PTH if all you need is SMT?
Coupon possibilities to include:
Mainstream SMT (SOIC, 0603 and larger)
Advanced SMT (fine pitch, TSSOP, QFP, BGA, 0402)
Cutting edge SMT (CSP, uBGA, Flipchip, 0201)
Mixed (Mainstream SMT and PTH)
PTH

Qualification could then used one or more coupon set to complete.

2. What would you add or subtract from the test board to make it more
useful to you?

SOT, Dpak, Melf, 0402, TSSOP, PLCC

3. Should there be two offerings of qualification vehicles, "cutting
edge" vs. "mainstream"? Cutting edge would incorporate fine pitch, flip
chips, CSPs, etc., where the mainstream board would not.

Multiple offering would allow for better specific process qual.
If I need fine pitch but don't use CSP, do I need to qual using CSP capabilities?

4. Extra Credit question: What was the greatest thing "before" sliced
bread?

Penny Candy!!

Doug Pauls
Rockwell Collins

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