1. I think mixing the technology on one coupon is a mistake because of the ramifications that could be caused by auto insert versus machine insert, wave or hand solder, etc. I would rather see different coupons for different families or technologies. You could have one that is just through hole, one that is typical mainstream sm production *have fun defining mainstream*, and a more advanced coupon for more cutting edge parts. 2. I would add more ranges in discretes. Like bottom only parts, bga diodes, ranges of 0201, 0402, 0603's etc. I would also like to see tsops and that type. 3. Cold coke in a bottle for a quarter. Kat >>> [log in to unmask] 03/19/04 10:17AM >>> OK class, time for your next assignment. Again, the topic is "qualifying" a manufacturing process, either in house or from a supplier. Steve Gregory has been kind enough to post a picture for me http://www.stevezeva.homestead.com and look for "IEC Coupon". This is a coupon that has been proposed in the IEC specification that Graham Naisbitt is working on. There is some re-design efforts going on currently. One such effort is to add through holes for a connector or pin field. As you can see from the picture, the current board is purely surface mount. So, your assigment, in essay form, is to answer the following three questions: 1. As a process qualification vehicle, should the vehicle be pure surface mount, or mixed technology (both SMT and PTH), and why? 2. What would you add or subtract from the test board to make it more useful to you? 3. Should there be two offerings of qualification vehicles, "cutting edge" vs. "mainstream"? Cutting edge would incorporate fine pitch, flip chips, CSPs, etc., where the mainstream board would not. 4. Extra Credit question: What was the greatest thing "before" sliced bread? Doug Pauls Rockwell Collins --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------