Thanks a lot. It sounds like and "unexpected" result. I'll take a look because I'd also like to know what they are saying about "Black Pad". Regards, Vladimir Sent from my Blackberry Wireless Vladimir Igoshev, 519-888-7465 ext.5283 -----Original Message----- From: [log in to unmask] <[log in to unmask]> To: [log in to unmask] <[log in to unmask]>; Vladimir Igoshev <[log in to unmask]> Sent: Thu Mar 18 10:29:34 2004 Subject: RE: [TN] Atotech presented a paper at IPC that showed P levels above 10 (up to 14%) actually resulted in better solderability and less brittle fracture of solder joints. Not sure what is gospel truth here, but I thought I would throw that out for you all to opine. Doug Corbett L-3 Communications-Systems West -----Original Message----- From: Vladimir Igoshev [mailto:[log in to unmask]] Sent: Thursday, March 18, 2004 8:12 AM To: [log in to unmask] Subject: Re: [TN] Importance: Low I forgot to answer your "phosphorous" question. "Normal" concentration is around 7-10% (that is what people say). A higher level will result in "Black Pad", but solderability should be fine. I'd quests that even higher content of P could result in a solderability issue. Yes, you can check (rather estimate) the content with EDS, but I wouldn't do it right from the surface, but rather use a cross-sectioned component. Regards, Vladimir Vladimir Igoshev, Research in Motion -----Original Message----- From: Somtawin Pornpottanamas [mailto:[log in to unmask]] Sent: Wednesday, March 17, 2004 8:21 PM To: TechNet E-Mail Forum.; Vladimir Igoshev Subject: RE: [TN] Hi Vladimir, By visual and SEM, we couldn't see anything on surface, all good and bad part show nothing different. Just EDX analysis that show Fe contain in bad part. So we though may be the Nickel bath had Fe contaminated. For %P , Can we check by EDX? And how high to cause the problem? Thanks & Regards, Somtawin Pornpottanamas Material Engineer -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Vladimir Igoshev Sent: Thursday, March 18, 2004 3:57 AM To: [log in to unmask] Subject: Re: [TN] Hi Somtawin, First thing I'd suspect is oxidation/contamination of the solderable surface. EDS may not catch it if it's just oxidation (the layer would be too thin for the method). lathe fact that you see Fe does not make me very optimistic. How does it show up, as inclusions (embedded into the surface) or "dissolved" in the plating? Second thing would be the content of P. If it's too high, then it might be a problem as well. Regards, Vladimir Vladimir Igoshev, Research in Motion -----Original Message----- From: Somtawin Pornpottanamas [mailto:[log in to unmask]] Sent: Tuesday, March 16, 2004 11:44 PM To: [log in to unmask] Subject: [TN] Now we have some problem in one component. The component was plated Nickel (electroplated) , and base material is phosphor bronze. The problem we found was solderability failed. We try to find out what's the cause. We have to inspect the solderability by dipping test before passed to the line. Some failed some passed. we had done the analysis to compare the good one and bad one. We had check Nickel thickness (XRF, cross section), phosphorus content and grain structure (by SEM & EDX). From the data , it show the different. But we don't know how does it effect to the solderability. Does anyone know what 's the parameter that affect to solderability, how? And what 's about the contaminate in Nickel bath ? From EDX we found Fe element in bad part, does Fe effect to solderability? Thanks & Regards, Somtawin Pornpottanamas --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------