Now we have some problem in one component. The component was plated Nickel (electroplated) , and base material is phosphor bronze. The problem we found was solderability failed. We try to find out what's the cause. We have to inspect the solderability by dipping test before passed to the line. Some failed some passed. we had done the analysis to compare the good one and bad one. We had check Nickel thickness (XRF, cross section), phosphorus content and grain structure (by SEM & EDX). From the data , it show the different. But we don't know how does it effect to the solderability. Does anyone know what 's the parameter that affect to solderability, how? And what 's about the contaminate in Nickel bath ? From EDX we found Fe element in bad part, does Fe effect to solderability? Thanks & Regards, Somtawin Pornpottanamas --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------