On 22 Mar 2004 at 10:36, Jason Lineback wrote: > Hello > > Is there a trend coming to use round pads for SMT components? Theoretically, there should be. The major PRO might be the much better paste release and cleaner stencils. Some studies (IIRC) showed better mechanical performance of solder joints. For PCB design, the rounded corner may be the additional 10 µm clearance you need for a difficult routing. Disadvantage may be that anything which is not really round or oblong (radius = half of the smaller dimension) is no standard gerber aperture. It can be drawn, then it can happen that CAM at the fab house runs draw to flash and replaces the drawn rounded rectangles by classic rectangels > sometimes DRC problems, spacings etc. Or it can be defined as Gerber Macro or custom aperture, then your data may fall apart because of gerber """standard""" misinterprertations. Regards Matthias Mansfeld -- Matthias Mansfeld Elektronik * Leiterplattenlayout, Bestueckung Am Langhoelzl 11, 85540 Haar; Tel.: 089/4620 093-7, Fax: -8 Internet: http://www.mansfeld-elektronik.de GPG http://www.mansfeld-elektronik.de/gnupgkey/mansfeld.asc --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------