Dave, What about the 'flip side' of this issue? Is there any concern about alternative component lead coatings (e.g. Tin-Lead-Silver) with the use of Eutectic solder attachment? Thanks, Jim Kittel L-3 Communications -----Original Message----- From: Dave Hillman [mailto:[log in to unmask]] Sent: Friday, March 05, 2004 7:15 AM To: [log in to unmask] Subject: Re: [TN] Lead-free components in SnPb processes Hi Scott! There appears to be two distinct industry camps on the topic of Pb contamination of Pbfree solder joints. One camp is of the opinion that the presence of Pb is detrimental to Pbfree solder joints and significantly reduces the thermal cycle fatigue life. The opposing camp is of the opinion that the presence of Pb does not impact or only slightly degrades a Pbfree solder joint thermal cycle fatigue life. Lots of data, lots of good discussion - most folks are concern with the issue in relation to how to deal with "legacy product" processes. There will be some pretty good data available later this year - the JGPP consortia study and NEMI consortia are working on the issue. There were a couple of papers presented at APEX on the topic too but I haven't had the chance to read them yet. IMHO the issue of Pb contamination may boil down to understanding how much lead (i.e. what percentage) can a Pbfree solder joint tolerate before metallurgical reactions result in degradation. Dave Hillman Rockwell Collins [log in to unmask] Scott Lefebvre <ScottLefebvre@NV To: [log in to unmask] ISION1.COM> cc: Sent by: TechNet Subject: Re: [TN] Lead-free components in SnPb processes <[log in to unmask]> 03/04/2004 11:12 AM Please respond to "TechNet E-Mail Forum."; Please respond to Scott Lefebvre I would like to add a concern that I have on this issue of Pb Free components. What is the industry doing about cross contamination of Pb Free components be soldered with SnPb solder as well as SnPb components soldered with Pb Free solder. I know of a few concerns about cross contamination but I would like to hear what all the techneters have to say on this issue. Scott -----Original Message----- From: Dave Hillman [mailto:[log in to unmask]] Sent: Wednesday, March 03, 2004 4:56 PM Subject: Re: Lead-free components in SnPb processes Hi Blair! One issue to consider with the industry move toward Pbfree soldering processing is that a number of component fabricators are moving to matte tin as a component lead finish. Matte tin is not as robust in terms of solder process and shelf life solderability in comparison to a tin/lead component lead finish (matte tin oxidizes must faster). The use of a nitrogen reflow environment and possible changes in your flux formulation are two possible avenues of investigation to increase your reflow process window . Good Luck. Dave Hillman Rockwell Collins [log in to unmask] "Blair K. Hogg" <blair.k.hogg@GAI-T To: [log in to unmask] RONICS.COM> cc: Sent by: TechNet Subject: [TN] Lead-free components in SnPb processes <[log in to unmask]> 03/03/2004 09:28 AM Please respond to "TechNet E-Mail Forum."; Please respond to "Blair K. Hogg" Hi Technetters, We've been seeing increasing problems in our SMT processes with wetting of component leads and I am wondering if our processes which were designed around all SnPb materials now need to be updated as I have a strong suspicion that we are seeing components with lead-free terminations. Are lead-free components drop-in replacements in SnPb processes? Has anyone here had to adjust processes due to lead-free component terminations? Thanks, Blair ********************************************************************** This email and any files transmitted with it are confidential and intended solely for the use of the individual or entity to whom they are addressed. 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