Hi Blair! One issue to consider with the industry move toward Pbfree soldering processing is that a number of component fabricators are moving to matte tin as a component lead finish. Matte tin is not as robust in terms of solder process and shelf life solderability in comparison to a tin/lead component lead finish (matte tin oxidizes must faster). The use of a nitrogen reflow environment and possible changes in your flux formulation are two possible avenues of investigation to increase your reflow process window . Good Luck. Dave Hillman Rockwell Collins [log in to unmask] "Blair K. Hogg" <blair.k.hogg@GAI-T To: [log in to unmask] RONICS.COM> cc: Sent by: TechNet Subject: [TN] Lead-free components in SnPb processes <[log in to unmask]> 03/03/2004 09:28 AM Please respond to "TechNet E-Mail Forum."; Please respond to "Blair K. Hogg" Hi Technetters, We've been seeing increasing problems in our SMT processes with wetting of component leads and I am wondering if our processes which were designed around all SnPb materials now need to be updated as I have a strong suspicion that we are seeing components with lead-free terminations. Are lead-free components drop-in replacements in SnPb processes? Has anyone here had to adjust processes due to lead-free component terminations? Thanks, Blair ********************************************************************** This email and any files transmitted with it are confidential and intended solely for the use of the individual or entity to whom they are addressed. If you have received this email in error please notify the system manager. This footnote also confirms that this email message has been swept for the presence of computer viruses. www.hubbell.com - Hubbell Incorporated ********************************************************************** --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------