Thanks Steve, I assume this applies to the collapsed height, like spheres with a diameter of 0.050" will be 0.0375" high after soldering. But is it possible to put some tolerances on this, let's say <the height after soldering will be 0.037" +/- 0.004"> ? Of course, it is assumed that the process is stable, consistent volume of printed paste, and consistent reflow recipe. Best regards, Ioan > -----Original Message----- > From: [log in to unmask] [SMTP:[log in to unmask]] > Sent: Monday, March 29, 2004 9:09 AM > To: [log in to unmask]; [log in to unmask] > Subject: Re: [TN] BGA height after soldering > > Hi Ioan! > > A good figure to use is 25%...of course this goes without saying the > figure only applies to eutectic balls. > > -Steve Gregory- > > > > > Hi Techos, > > a question about BGA collapsing. I have an application where we have > to fit > an assembled PCB into a tight place. The highest part is a BGA and I > wonder > if anybody has knowledge of the height tolerances after soldering. > > Thenks, > Ioan > > > > --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------