Gary, Good points. Can you refer me to any studies that associate VIP design vs. "unacceptable" voiding? A little voiding may be good for reliability but too much is not good. I struggle with determining how large or deep a VIP can be before it contributes or causes unacceptable voiding. joe -----Original Message----- From: Gary Ferrari [mailto:[log in to unmask]] Sent: Thursday, March 11, 2004 2:20 PM To: [log in to unmask] Subject: Re: [TN] Reliability of via in pad Technetters, Please let us not throw the baby out with the bath water. I would hate for VIP technology to get a bad name when in essence your valid concerns are associated with larger vias than used in HDI technology. A similar panic was created against dry film soldermasks because the commonly used dry film mask thicknesses were around 0.006 in. When mask manufacturers introduced high conformance thin masks (0.001 - 0.002 in) to address the needs of SMT , everyone shunned them because they were "dry film", when in reality their gripes were with the thicker cousins. Regards, Gary --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------