Hi Technos, I've got an annoying one. I am looking at an assembly for automotive, which has 100+ SMT resistor and capacitor pads with vias in them, on both sides of the 9 layer PCB. Now, I know that I will expect solder starvation, since the solder will flow into the via. I could eventually patch this by plugging the vias on the opposite sides of the concerned pads and make slightly bigger apertures in the stencil. Or even charge more and touch-up all the opens. But what does via in pad mean in terms of reliability? 1. There will be voids, which are going to become even more important on lead-free (the customer is after the european market). Any reliability concerns related to that? Once again, I'm talking automotive. 2. PTH reliability. 100+ vias will have totally random quantities of solder in them. I remember one of Werner's contributions (Entschuldigung Herr Engelmeier, aber... I lost the e-mail) saying that less than 50% fill degrades the reliability. Am I right? A good fix would be, in case they refuse to re-spin the board and move the vias, to fill the holes. What kind of specification should I issue for filling, in terms of material and fill percentage? Any other concerns? Thanks, Ioan --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------