Hi Bill, The work at Bell Labs was to my knowledge much earlier--Ref: Kotlowitz, R. W., and W. Engelmaier, “Impact of Lead Compliance on the Solder Attachment Reliability of Leaded Surface Mount Devices,” Proc. 6th Annual Int. Electronics Packaging Conf. (IEPS), San Diego, CA, November 1986, p. 841; and Engelmaier, W., “Surface Mount Attachment Reliability of Clip-Leaded Ceramic Chip Carriers on FR-4 Circuit Boards,” Proc. 7th Annual Int. Electronics Packaging Conf. (IEPS), Boston, MA, November 1987, p. 104; also in IEPS J., Vol. 9, No. 4, January 1988, p. 3; also in Proc. Nepcon/East, Boston, MA, June 1988, p. 121. Regards, Werner Engelmaier Engelmaier Associates, L.C. Electronic Packaging, Interconnection and Reliability Consulting 7 Jasmine Run Ormond Beach, FL 32174 USA Phone: 386-437-8747, Fax: 386-437-8737 E-mail: [log in to unmask], Website: www.engelmaier.com --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------