Hi all I am looking for information and specifications on the time that a PCB (FR4, Tg 130 - 140degC) can withstand REWORK temperatures. I amn't overlooking all other rework considerations such as component capability, solder, flux etc as well as PCB specific issues such as CTE, Thermal Shock, Thermal Mass, Solder Mask. I am just trying to reference an IPC or MIL STD specification that tells me FR4 will withstand Xsecs above Tg temp and Xsecs above solder liquidus. All assistance appreciated Best Rgds Moss --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------