Dear technetters We are doing solder mask on key pad pcbs after gold plating. In this process,gold plating thickness is reduced during mechanical scrubbing operation which is done just before solder mask flooding. Is there any solution to avoid reduction of gold plating thickness? Also let us know, whether gold plating can be done after the solder masking process? If so briefly explain the process. Regards, Mr.Murulidhara S. Deputy Chief Engineer , PCB and Chemical Lab - R&D, ITI Ltd. , Dooravani Nagar , Bangalore INDIA PIN-560 016 Ph : 91-080-8503959 Fax : 91-080-5650971 --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------