Thanks Dave. We haven't been confused enough, is that what you meant? :-) Here are the data I was referring to: http://www.sirius-tech.com/enproducts/acn3.htm http://www.astm.org/cgi-bin/SoftCart.exe/DATABASE.CART/REDLINE_PAGES/B607.htm?E+mystore Vladimir Vladimir Igoshev, Research in Motion 451 Phillip St. Waterloo, ON, N2L 3X2 Voice: (+1) 519-888-7465, ext. 5283 Fax: (+1) 519-886-0863 E-mail: [log in to unmask] <mailto:[log in to unmask]> -----Original Message----- From: [log in to unmask] [mailto:[log in to unmask]] Sent: Wednesday, February 18, 2004 1:01 PM To: [log in to unmask]; Vladimir Igoshev Cc: [log in to unmask] Subject: Re: [TN] Electroless Ni-B Hi guys! Well, here is more information to add to the confusion; The Metal Finish Suppliers Association Electroless Nickel Plating Guide (volume 1, no. 5) lists specifically a boron range of 0.1%-0.3% for soldering applications and describes in general of keeping the boron less than 1% for solderability. Dave Hillman Rockwell Collins [log in to unmask] Vladimir Igoshev <[log in to unmask] To: [log in to unmask] > cc: Sent by: TechNet Subject: Re: [TN] Electroless Ni-B <[log in to unmask]> 02/18/2004 11:29 AM Please respond to "TechNet E-Mail Forum."; Please respond to Vladimir Igoshev Steven, Thanks a lot. I haven't been very successful in my search. So far I found very contradictory data, saying that for a solderable surface it should be between 0.1% and 10% of B, or up to 3-5% (from another source). I've also posted the question on the www.finishing.com website and hope it'll help. You can keep an eye on it from here. http://www.finishing.com/274/65.html I want to know what the difference is at the solder/plating interface between two types of EN. May I ask what is your concern? Regards, Vladimir Vladimir Igoshev, Research in Motion Voice: (+1) 519-888-7465, ext. 5283 Fax: (+1) 519-886-0863 E-mail: [log in to unmask] <mailto:[log in to unmask]> -----Original Message----- From: Creswick, Steven [mailto:[log in to unmask]] Sent: Wednesday, February 18, 2004 12:10 PM To: TechNet E-Mail Forum.; Vladimir Igoshev Subject: RE: [TN] Electroless Ni-B Vladimir, Since no real "plating person" has yet replied, I will toss out what meager info I have. My notes were that <1% B yielded readily solderable and wedge bondable surfaces where as baths of 2-3% B were noticeably hard (but no notation on wirebondability or solderability). Some baths can be 5-6% B, but have no specific comments of them either. Should you get any further comments, I am very interested in them as well. Sorry, but I can not define what 'normal' is. Presume it is specific to the plating house and what they are currently running. Steven Creswick - Gentex Corporation -----Original Message----- From: Vladimir Igoshev [mailto:[log in to unmask]] Sent: Tuesday, February 17, 2004 1:32 PM To: [log in to unmask] Subject: [TN] Electroless Ni-B Techneters, Does anybody know what a "normal" content of boron should be in an electroless Ni-B plating? Thanks a lot in advance. Vladimir Igoshev, Research in Motion --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------