Hello , Thank for your help. I send you some pictures showing X-section of the solder joints. I am not expert on this topic. Please comment on them. Fig. 2 X-section through non soldered pad with Au layer showing very rough Ni Layer Fig. 6 X-section of a unseperated solder joint Fig.8 X-section (etched) of a solder joint showing a strange Ni-solder interface Fig. 10 Pictures of broken pads and peeled SMD resistor regards Waclaw Leo Higgins schrieb: >This sounds like either typical black pad problem, or a passivated Ni >surface under the very thin immersion gold layer. A determination of the >failure interface as suggested by another respondent is necessary. A >cross-section of a failed interface and an unseparated interface from the >same sample set would help in making a diagnosis (SEM / EDX map and line >scans for O, Ni, Sn, P). A scanning Auger map of the surface can help in >seeing if the Au deposit is low density or porous, and if it has allowed Ni >to oxidize and prevent good wetting after the Au is dissolved in the solder. > > >Regards, >Leo > >------------------------------------ >Leo M. Higgins III, Ph.D. >ASAT Inc. >Central Region Mgr. / Director of Sales >[log in to unmask] >3755 Capital of Texas Hwy-So >Suite 100 >Austin, TX USA 78726 >tel: 512-383-4593 >fax: 512-383-1590 >mobile: 512-423-2002 >------------------------------------ > > >-----Original Message----- >From: karpinski [mailto:[log in to unmask]] >Sent: Wednesday, February 18, 2004 3:38 PM >To: [log in to unmask] >Subject: Re: [TN] Ni/Au solderability on kapton > > >Hi Vladimir, > >As I know it is Pd. >regards > >Vladimir Igoshev schrieb: > > > >>Hi Waclaw, >> >>Do you know what material (Pd or Ru) your board supplier uses to deposit >> >> >electroless Ni? > > >>Vladimir Igoshev, >>Research in Motion >> >>Voice: (+1) 519-888-7465, ext. 5283 >>Fax: (+1) 519-886-0863 >>E-mail: [log in to unmask] <mailto:[log in to unmask]> >> >> >>-----Original Message----- >>From: karpinski [mailto:[log in to unmask]] >>Sent: Wednesday, February 18, 2004 4:15 PM >>To: [log in to unmask] >>Subject: [TN] Ni/Au solderability on kapton >> >> >>Recently we have solderability problems with Ni/Au kapton flex boards >>(0,1 µm Au, 3 µm Ni, 35m Cu). >>We have produced and assembled large number of boards. >>On 10 % of the boards we observe interconnection failures after final >>assembly of the pcbs. If the suspected solder joints are lightly >>stressed , the connections are easily broken, leaving an open circuits. >>It is easy to peel these parts with solder material from the boards. >>The pads below the removed parts are discolored dark gray and are sleek . >>Some times the handsoldering of the broken joins was successful but >>after small strain the joints broke again. >>Additional vapor phase soldering did not improved the the strength of >>the joints. >>This is new problem for us. Does anyone have any experience with this? >>How to rework the boards? How to determine when a board should be >>reworked or >>scrapped? What about reliability issues? Latent failures? >>I would appreciate your help very much >> regards >> >>-- >>Waclaw Karpinski >>I. Physikalisches Institut >>RWTH Aachen >>D - 52074 Aachen >> >>--------------------------------------------------- >>Technet Mail List provided as a service by IPC using LISTSERV 1.8e >>To unsubscribe, send a message to [log in to unmask] with following text in >>the BODY (NOT the subject field): SIGNOFF Technet >>To temporarily halt or (re-start) delivery of Technet send e-mail to >> >> >[log in to unmask]: SET Technet NOMAIL or (MAIL) > > >>To receive ONE mailing per day of all the posts: send e-mail to >> >> >[log in to unmask]: SET Technet Digest > > >>Search the archives of previous posts at: http://listserv.ipc.org/archives >>Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 >> >> >for additional information, or contact Keach Sasamori at [log in to unmask] or >847-509-9700 ext.5315 > > >>----------------------------------------------------- >> >>--------------------------------------------------- >>Technet Mail List provided as a service by IPC using LISTSERV 1.8e >>To unsubscribe, send a message to [log in to unmask] with following text in >>the BODY (NOT the subject field): SIGNOFF Technet >>To temporarily halt or (re-start) delivery of Technet send e-mail to >> >> >[log in to unmask]: SET Technet NOMAIL or (MAIL) > > >>To receive ONE mailing per day of all the posts: send e-mail to >> >> >[log in to unmask]: SET Technet Digest > > >>Search the archives of previous posts at: http://listserv.ipc.org/archives >>Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 >> >> >for additional information, or contact Keach Sasamori at [log in to unmask] or >847-509-9700 ext.5315 > > >>----------------------------------------------------- >> >> >> >> >> >> > >-- >Waclaw Karpinski >I. Physikalisches Institut >RWTH Aachen >D - 52074 Aachen >Sommerfeldstr 14, Turm 28 >Tel.: +241 802 7181 >Fax.: +241 802 2623 >Mobil: 0049 173 70 22 548 > >--------------------------------------------------- >Technet Mail List provided as a service by IPC using LISTSERV 1.8e >To unsubscribe, send a message to [log in to unmask] with following text in >the BODY (NOT the subject field): SIGNOFF Technet >To temporarily halt or (re-start) delivery of Technet send e-mail to >[log in to unmask]: SET Technet NOMAIL or (MAIL) >To receive ONE mailing per day of all the posts: send e-mail to >[log in to unmask]: SET Technet Digest >Search the archives of previous posts at: http://listserv.ipc.org/archives >Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 >for additional information, or contact Keach Sasamori at [log in to unmask] or >847-509-9700 ext.5315 >----------------------------------------------------- > >--------------------------------------------------- >Technet Mail List provided as a service by IPC using LISTSERV 1.8e >To unsubscribe, send a message to [log in to unmask] with following text in >the BODY (NOT the subject field): SIGNOFF Technet >To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) >To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest >Search the archives of previous posts at: http://listserv.ipc.org/archives >Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 >----------------------------------------------------- > > > > -- Waclaw Karpinski I. Physikalisches Institut RWTH Aachen D - 52074 Aachen Sommerfeldstr 14, Turm 28 Tel.: +241 802 7181 Fax.: +241 802 2623 Mobil: 0049 173 70 22 548 --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------