In a previous life, we used to use a Centech vapor phase reflow to reflow large backplanes. May have issues with thermal shock due to the large temperature gradient generated when the vapor phase fluid (which is very expensive) condenses on the board and gives up the latent heat (heats up the board). On the positive side, it is impossible to overheat the board and can heat up large thermal masses quickly. Also maybe a preheat of a board before running the boards thru the solder wave with some topside flux application (just make sure that the flux gets properly activated and cleaned off). Hope this helps Tom Gervascio Senior Process Engineer Sparton Electronics (352) 540-4040 >>> [log in to unmask] 02/24/04 02:50PM >>> Hi everyone, I am a Manufacturing Engineering in an area that builds test equipment for airborne radar systems. For the past several months Design Engineering has been giving us a variety of "thick" boards to which to solder thru hole components. The boards range in thickness up to .250". We have been substituting press-in sockets where possible, but they are not always available in the sizes we need. So far, in the most difficult situations, I have been using an Airvac solder volcano. This works fairly well, but can't be used in all situations, and doesn't always result in flow thru to the other side. Is there any other system that would be more appropriate for thick boards where flow thru is a problem? We are working to J-Std-001B Class 3. We are ready to go back to the designers (and have gone back to them), but I would like to find out if there are other possibilities first. Thanks for any help you can give, Bill Mengers Mfg. Engineer Northrop Grumman Corp. Baltimore --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------