Water sol products are used routinely in manufacturing many types of leadless area array devices. In assembly access can be an issue for any process involving aqueous or semi aqueous (as for no cleans) processes as Ryan describes. Regards Mike Fenner Indium Corporation T: + 44 1908 580 400 M: + 44 7810 526 317 F: + 44 1908 580 411 E: [log in to unmask] W: www.indium.com Pb-free: www.Pb-Free.com -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Ryan Grant Sent: Tuesday, February 24, 2004 10:26 PM To: [log in to unmask] Subject: Re: [TN] BGA and Water solube paste Hi Yannick, Water soluble paste and the alloy mixture of the paste and/or BGA have nothing to do with each other. Water soluble is talking about the flux vehicle of the solder pastes (the non-metal stuff in the solder paste). 2% silver alloy solder paste is absolutely compatible with BGA. Water soluble flux is compatible with BGA, but your cleaning equipment may not be compatible with BGA. Water soluble flux residue must be cleaned off the PCB very well or you are very likely to have electromigration failures after some time in the field. If the BGA ball diameter is 0.030" or larger, most modern in-line aqueous cleaners do a fine job. When you get to 0.013" diameter BGA balls, cleaning life becomes difficult, (but not impossible). Anything in-between and clean ability just depends. Ryan Grant -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Yannick Brisson Sent: Tuesday, February 24, 2004 2:47 PM To: [log in to unmask] Subject: [TN] BGA and Water solube paste Hi, Somebody here just ask me something about BGA and water soluble paste. He wants to know if water soluble and BGA could work together. Most of the BGA avec a ball of 63/37 and water soluble can have the same composition too but some have 2 Ag in it. Can it be compatible? What about the flux? Thank you Yannick --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- ::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::::: This email, its content and any files transmitted with it are intended solely for the addressee(s) and may be legally privileged and/or confidential. 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